3D Ceramic Printing for Electronics and Wafer Manufacturing

Sinto Advanced Ceramics USA 3d printing for electronics and wafter manufacturing

Sinto Advanced Ceramics can print wafers, boards, heat sinks, connectors, and covers out of a range of technical ceramics.

Let us know what your needs are and we can develop a printable shape and application specific part for you and recommend the best ceramic for your application.

Whether you need a production run or are still developing the shape you need let us help you get your electronic needs into production



C101C900Form 4
Material (all layer heights in µm)
Alumina50 / 10010050
3Y Zirconia50 / 100--50¹
5Y50 / 100----
8Y50 / 100----
Silica Core Material50 / 100--50¹
Aluminum Nitride50²----
Silicon Nitride50²----
Specs
Printer Volume³100 x 100 x 150 mm300 x 300 x 100 mm200 x 125 x 210 mm
Printer Accuracy± 50 µm± 50 µm± 75 µm
Smallest Negative Feature500 µm500 µm600 µm
Smallest Positive Feature200 µm200 µm400 µm
Maximum Wall Thickness6 mm6 mm6 mm
  • ¹In development, coming soon
  • ²Firing of nitrides is not currently available in the US and will need to be done at a different site. We expect this capability by early 2027 in the US.
  • ³Keep in mind that all printer volumes are for the raw printer volume – parts typically shrink by 20-30%, so 100 mm may only be ~82 mm of sintered part

Alumina (low purity – 97%)
Alumina (high purity – 99.99%)
3Y Zirconia
5Y Zirconia
Investment Casting Silica
Alumina Toughened Zirconia (ATZ)
Zirconia Toughened Alumina (ZTA)


Explore the complete lineup of advanced 3D printers and systems

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