Electronics and WAFER Manufacturing
Sinto Advanced ceramics can print wafers, boards, heat sinks, connectors, and covers out of a range of technical ceramics. Let us know what your needs are and we can develop a printable shape and application specific part for you and recommend the best ceramic for your application. Weather you need a production run or are still developing the shape you need let us help you get your electronic needs into production
Applications:
- Heat sinks
- High temperature connectors
- alumina boards
- Wafer spatula
- Wafer Carriers
- Thermally conductive covers
- Electrical insulators
Specs
| C101 | C900 | Form 4 | |
|---|---|---|---|
| Material (all layer heights in µm) | |||
| Alumina | 50 / 100 | 100 | 50 |
| 3Y Zirconia | 50 / 100 | -- | 50¹ |
| 5Y | 50 / 100 | -- | -- |
| 8Y | 50 / 100 | -- | -- |
| Silica Core Material | 50 / 100 | -- | 50¹ |
| Aluminum Nitride | 50² | -- | -- |
| Silicon Nitride | 50² | -- | -- |
| Specs | |||
| Printer Volume³ | 100 x 100 x 150 mm | 300 x 300 x 100 mm | 200 x 125 x 210 mm |
| Printer Accuracy | ± 50 µm | ± 50 µm | ± 75 µm |
| Smallest Negative Feature | 500 µm | 500 µm | 600 µm |
| Smallest Positive Feature | 200 µm | 200 µm | 400 µm |
| Maximum Wall Thickness | 6 mm | 6 mm | 6 mm |
¹In development, coming soon
²Firing of nitrides is not currently available in the US and will need to be done at a different site. We expect this capability by early 2027 in the US.
³Keep in mind that all printer volumes are for the raw printer volume – parts typically shrink by 20-30%, so 100 mm may only be ~82 mm of sintered part
Materials
- Alumina (low purity – 97%)
- Alumina (high purity – 99.99%)
- 3Y Zirconia
- 5Y Zirconia
- Investment Casting Silica
- Alumina Toughened Zirconia (ATZ)
- Zirconia Toughened Alumina (ZTA)